Apple’s upcoming smartphone revision, often referred to as iPhone 6s, will feature a completely redesigned wireless system and will utilized a new LTE chip made by Qualcomm, as reported by 9to5mac based on the images they received of the alleged logic board of an iPhone 6s prototype.
Images of a purported iPhone 6s prototype internals sourced by 9to5mac, show that the new device will feature Qualcomm’s MDM9635M chip, also known as the ‘9X35? Gobi modem platform. This alleged new chip promises to provide significant performance boost over the “9X25? chip that Apple used in iPhone 6 and the iPhone 6 Plus. Theoretically, the alleged chip is capable of delivering twice the LTE download speed of an iPhone 6 and iPhone 6 Plus.
The MDM9635M chip’s manufacturing is based on the 20nm process, which makes the chip thinner, more energy efficient and smaller in size than the LTE MDM9625M chipset used in iPhone 6. While this chip of interest is capable of reaching download speeds of up to 300Mbps, the upload speeds are still capped at 50Mbps. If the report turned out to be true, iPhone 6s still won’t be the first smartphone to get this chip, as some of the Android smartphones of last year has this chip inside them.
Source of these images also revealed to 9to5mac that the motherboard of this iPhone 6s prototype is narrower than the current generation iPhone models, allowing Apple to make use of the extra space by featuring a battery with larger capacity.
In an earlier report, we posted leaked photos of an iPhone 6s rear shell. The next-generation iPhone a.k.a iPhone 6s is widely rumoured to come with Force Touch display, 7000 Series Aluminium, an improved 12 megapixels rear camera sensor among other features.