Sonny Dickson, a reputable source of Apple leaks in the past, such as iPhone 5S parts, iPad Air and information about iPhone 5c before these devices were even launched, has just tweeted some interesting iPhone 6 specs.
Sonny claims that the next generation iPhone, popularly dubbed as iPhone 6, will be 0.22-inches thick making it almost 27% thinner than iPhone 5S, which is 0.30-inches thick. He also claims that iPhone 6 will be powered with an all new 2.6GHz A8 chip, which will be a huge jump over the existing 1.3GHz A7 chip found in iPhone 5S. He further claims that the iPhone 6 will feature an Ultra-Retina display with 389 ppi density, iPhone 5s has a 326 ppi density display.
Here are the iPhone 6 specifications shared by Sonny Dickson in a series of tweets:
- iPhone 6 will be 0.22 inches thick #JustSaying
- Ultra-Retina screen will be 389 ppi #JustSaying
- The new Apple A8 processor will run at 2.6 GHz. #JustSaying
- These specs could be the real thing #JustSaying
So what you think of an iPhone 6 with a 2.6GHz A8 Chip, Ultra Retina 389 ppi Display, and 27% thinner compared to an iPhone 5S? and what if all these specs come packed in this iPhone 6 concept.
